メタ情報
| meta description平均長 | 52.38 |
|---|
| OGPありページ数 | 0 |
|---|
| Twitterカードありページ数 | 0 |
|---|
内部リンク分析（Internal）
| ユニーク内部リンク数 | 33 |
|---|
| ページあたり内部リンク平均 | 25.35 |
|---|
連絡先候補（Contacts）
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キーワード分析（KeywordMap）
ワードクラウド上位
| 語 | 重み |
|---|
| has | 1 |
| introduced | 0.833333 |
| encapsulant | 0.833333 |
| new | 0.75 |
| Adhesives | 0.719898 |
| Underfill | 0.638374 |
| Conductive | 0.612238 |
| encapsulants | 0.612238 |
| Reworkable | 0.595815 |
| reliability | 0.582014 |
| underfill | 0.561218 |
| reworkable | 0.510198 |
| Encapsulant | 0.5 |
| adhesives | 0.495867 |
| board | 0.490117 |
| level | 0.490117 |
| Encapsulants | 0.459179 |
| BGAs | 0.416667 |
| adhesive | 0.408159 |
| Adhesive | 0.377675 |
| conductive | 0.340466 |
| designed | 0.340466 |
| Its | 0.333333 |
| its | 0.333333 |
| our | 0.333333 |
| Reliability | 0.333333 |
| CSPs | 0.333333 |
| encapsulation | 0.333333 |
| resistance | 0.333333 |
| electronics | 0.323954 |
| was | 0.314729 |
| attach | 0.306323 |
| Ruggedize | 0.306119 |
| raise | 0.306119 |
| Electrically | 0.306119 |
| low | 0.306119 |
| CSP | 0.297908 |
| assembly | 0.29654 |
| Stress | 0.287959 |
| BGA | 0.287959 |
| stress | 0.275691 |
| include | 0.266048 |
| chip | 0.260983 |
| die | 0.255099 |
| Edgebond | 0.251964 |
| Ultra | 0.251964 |
| Low | 0.251964 |
| attachment | 0.251783 |
| pastes | 0.251783 |
| component | 0.251783 |
共起語上位
| 語1 | 語2 | スコア | 共起ページ数 |
|---|
| board | level | 3.351762 | 60 |
| information | more | 3.072047 | 32 |
| information | specific | 3.072047 | 32 |
| has | introduced | 3.037558 | 40 |
| Low | Ultra | 2.972848 | 28 |
| level | reliability | 2.878202 | 53 |
| Low | Stress | 2.877204 | 28 |
| Ruggedize | raise | 2.856477 | 24 |
| Bragg | Grating | 2.716826 | 20 |
| chip | flip | 2.675459 | 28 |
| please | products | 2.673115 | 24 |
| Bragg | VCSEL | 2.604013 | 19 |
| encapsulant | underfill | 2.592166 | 32 |
| Assemble | optical | 2.577094 | 16 |
| connectors | ferrules | 2.543834 | 16 |
| Electrically | interconnect | 2.478694 | 15 |
| Electrically | ground | 2.478694 | 15 |
| RFID | smartcard | 2.469763 | 20 |
| devices | sensitive | 2.469763 | 20 |
| new | reworkable | 2.43548 | 28 |
| introduced | new | 2.43548 | 28 |
| applications | specific | 2.412798 | 32 |
| fiber | optical | 2.399145 | 16 |
| connectors | fiber | 2.399145 | 16 |
| VCSEL | ferrules | 2.399145 | 16 |
| more | specific | 2.389264 | 24 |
| BGA | CSP | 2.361468 | 21 |
| ground | interconnect | 2.319153 | 12 |
| Dam | Glob | 2.319153 | 12 |
| Dam | Fill | 2.319153 | 12 |
| Board | Enhances | 2.319153 | 12 |
| Board | Level | 2.319153 | 12 |
| sensitive | stress | 2.30173 | 20 |
| applications | products | 2.259417 | 32 |
| products | specific | 2.258309 | 24 |
| applications | please | 2.241213 | 24 |
| Stress | Ultra | 2.238706 | 21 |
| Adhesives | Conductive | 2.233475 | 39 |
| Conductive | Electrically | 2.198356 | 21 |
| Encapsulate | wirebonded | 2.168624 | 9 |
| Dissipate | heat | 2.16071 | 12 |
| Non | heat | 2.16071 | 12 |
| features | following | 2.16071 | 12 |
| Edgebond | Reworkable | 2.102378 | 24 |
| board | reliability | 2.088338 | 39 |
| board | raise | 2.060013 | 24 |
| Curable | Glob | 2.037812 | 12 |
| BGAs | Encapsulant | 2.01974 | 15 |
| Grating | VCSEL | 2.010655 | 14 |
| International | SMTA | 2.003531 | 8 |
被リンク情報
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